Do you know epoxy resin for high-performance electronic packaging materials?

电子封装胶是用于封装电子器件，是起到密封、包封或灌封的一类电子胶水或粘合剂。经电子封装胶封装后可以起到防水、防潮、防震、防尘、防腐蚀、散热、保密等的作用。因此，电子封装胶需要具有耐高低温，介电强度高，绝缘性好，环保安全的特点。

Electronic packaging adhesive is a kind of electronic glue or adhesive used to seal, package or encapsulate electronic devices. After being sealed by electronic packaging adhesive, it can play the role of waterproof, moisture-proof, shockproof, dustproof, anti-corrosion, heat dissipation, confidentiality, etc. Therefore, the electronic packaging adhesive needs to have the characteristics of high and low temperature resistance, high dielectric strength, good insulation, environmental protection and safety.

为什么选择环氧树脂作为电子封装胶？

Why choose epoxy resin as electronic packaging adhesive?

环氧树脂具有优良的耐热性、电绝缘性、密着性、介电性、力学性能及较小的收缩率、耐化学药品性，加入固化剂后又有较好的加工性和可操作性。因此，目前国外半导体器件较多采用环氧树脂进行封装。

Epoxy resin has excellent heat resistance, electrical insulation, adhesion, dielectric property, mechanical property, small shrinkage, chemical resistance, and good processability and operability after adding curing agent. Therefore, at present, foreign semiconductor devices are mostly encapsulated with epoxy resin.

环氧树脂的发展

The development of epoxy resin

随着环境保护呼吁的日益高涨以及集成电路工业对于电子封装材料性能要求的不断提高，对于环氧树脂提出了更高的要求。IC封装用的环氧树脂除了要求高纯度之外，低应力、耐热冲击和低吸水性也是有待解决的问题。

With the increasing call for environmental protection and the increasing requirements of the integrated circuit industry for the performance of electronic packaging materials, higher requirements are put forward for epoxy resin. In addition to the high purity of epoxy resin used for IC packaging, low stress, thermal shock resistance and low water absorption are also problems to be solved.

在未来的生产研究中，为了使环氧树脂能够全面应用于国内电子封装行业中，改进制备工艺技术、探索耐湿热高性能环氧树脂和中温耐湿热环氧树脂的固化体系，以及新型环氧树脂改性添加剂的制备是该研究领域的发展方向。

In the future production, in order to make the epoxy resin fully applied in the domestic electronic packaging industry, the development orientation of this research is to improve the production process technology, explore the curing system of high performance epoxy resin and medium-temperature high performance epoxy resin, as well as the preparation of new epoxy resin modification additives.

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